inductance 3 percent srf min 5 dcr max 6 imax part number 1 (nh) tolerance q min 4 (ghz) (ohst) (a) st413rad3n0_lz 2 3.0 @ 50 mhz 5 57 @ 1000 mhz >5.00 38 1.8 st413rad4n1_lz 4.1 @ 50 mhz 5 75 @ 1000 mhz >5.00 50 1.8 st413rad7n8_lz 2 7.8 @ 50 mhz 5 51 @ 500 mhz 3.80 50 1.6 st413rad10n_lz 10 @ 50 mhz 5,2 60 @ 500 mhz 3.20 60 1.5 st413rad12n_lz 12 @ 50 mhz 5,2 57 @ 500 mhz 2.40 60 1.5 st413rad18n_lz 18 @ 50 mhz 5,2 62 @ 350 mhz 2.10 70 1.4 st413rad22n_lz 22 @ 50 mhz 5,2 62 @ 350 mhz 2.05 70 1.4 st413rad33n_lz 33 @ 50 mhz 5,2 49 @ 150 mhz 1.70 90 1.2 st413rad36n_lz 36 @ 50 mhz 5,2 57 @ 150 mhz 1.40 90 1.1 st413rad39n_lz 39 @ 50 mhz 5,2 45 @ 150 mhz 1.30 90 1.1 st413rad47n_lz 47 @ 50 mhz 5,2,1 45 @ 150 mhz 1.45 120 0.95 st413rad56n_lz 56 @ 50 mhz 5,2,1 43 @ 150 mhz 1.08 120 0.95 st413rad68n_lz 68 @ 50 mhz 5,2,1 54 @ 150 mhz 1.15 130 0.85 st413rad82n_lz 82 @ 50 mhz 5,2,1 54 @ 150 mhz 1.06 160 0.80 st413radr10_lz 100 @ 50 mhz 5,2,1 51 @ 150 mhz 0.82 160 0.80 1. when ordering, specify tolerance, termination and testing codes: st413radr10 glz tolerance: f 1% g = 2% j = 5% termination: l = rohs compliant silver-palladium-platinum glass frit. special order: s = tin-lead (63/37) over silver-platinum-glass frit. t = tin-silver-copper (95.5/4/0.5) over silver-platinum- glass frit. testing: z = cots h = screening per coilcraft cp-sa-10001 2. part is wound on low profle coilform. 3. inductance measured using a coilcraft smd-a fxture in an agilent/ hp 4286a impedance analyzer or equivalent with coilcraft-provided correlation pieces. 4. q measured using an agilent/hp 4291a with an agilenthp 16197a test fxture or equivalents. 5. srf measured using an aglilent/hp 8753es network analyzeror equivalent and a coilcraft smd-d test fxture. 6. dcr measured on a keithley 580 micro-ohmmeter or equivalent and a coilcraft ccf858 test fxture. 7. electrical specifcations at 25c. refer to doc 362 soldering surface mount components before soldering. core material ceramic terminations silver-palladium-platinum-glass frit. ambient temperature C40c to +125c with imax current, +125c to +140c with derated current storage temperature component: C55c to +140c. tape and reel packaging: C55c to +80c resistance to soldering heat max three 40 second refows at +260c, parts cooled to room temperature between cycles temperature coeffcient of inductance (tcl) +25 to +155 ppm/c moisture sensitivity level (msl) 1 (unlimited foor life at <30c / 85% relative humidity) packaging 2000/7reel standard height parts: plastic tape: 8 mm wide, 0.23 mm thick, 4 mm pocket spacing, 1.8 mm pocket depth low profle parts: plastic tape: 8 mm wide, 0.3 mm thick, 4 mm pocket spacing, 1.6 mm pocket depth chip inductors for critical applications st413rad 1008 chip inductors highest q factors for this body size, roughly 20% higher than our xx 413raa parts. exceptional srfs, tight tolerance and batch consistency document st190-1 revised 11/06/12 ? ? coilcraft, inc. 2012 1102 silv er lak e road car y, il 60013 phone 800-981-0363 fa x 847-639-1508 email c ps@coilcraft.com www . coilcraft-cps . com this pr oduct may not be used in medical or hig h risk applications without prior coilcraft appr oval. specifications subject to change without notice. please check our web site for latest infor mation.
st413rad series (1008) 1008 chip inductors document st190-2 revised 11/06/12 a b c d max max max* ref e f g h i j 0.115 0.110 0.080 0.020 0.080 0.020 0.060 0.100 0.040 0.050 inches 2,92 2,79 2,03 0,51 2,03 0,51 1,52 2,54 1,02 1,27 mm *low profle parts: 0.050/1,27 0 10 20 30 40 50 60 70 80 90 100 110 120 10 100 1000 10000 frequency (mhz) q f actor 22 nh 10 nh 47 nh 3.0 nh 100 nh 68 nh 0 10 20 30 40 50 60 70 80 90 100 110 120 frequency (mhz) inductance (nh) 11 0 100 1000 10000 3.0 nh 10 nh 22 nh 47 nh 68 nh 100 nh typical l vs frequency typical q vs frequency current derating -40 -55 -20 02 04 06 08 0 100 160 140 120 ambient temperature (c) pe r cent of rated rms i 120 110 100 90 80 70 60 50 40 30 20 10 0 25c i i j h a b ov erall f g e ter minal f c d te r minal wraparound: appro x 0.015/0,38 both ends recommended land p attern pic k and place mater ial suggested land pattern note: dimensions are before optional solder application. for maximum overall dimensions including solder, add 0.0025 in / 0,064 mm to b and 0.006 in / 0,15 mm to a and c. ? ? coilcraft, inc. 2012 1102 silv er lak e road car y, il 60013 phone 800-981-0363 fa x 847-639-1508 email c ps@coilcraft.com www . coilcraft-cps . com this pr oduct may not be used in medical or hig h risk applications without prior coilcraft appr oval. specifications subject to change without notice. please check our web site for latest infor mation.
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